IPC-2581 Consortium at IPC-APEX EXPO 2016

At this year’s IPC-APEX EXPO, we saw a drastic shift on subject of IPC_2581 from “Why IPC-2581?” to “How can I leverage the format today across the supply chain?”. This was apparent with the questions we received after Gary Carter from Fujitsu delivered an exciting case study on how we realized a complete augmented utilization of IPC-2581 to drive a project from design to manufacturing, including assembly. There was sincere interest during the Design Forum on how to get started on using IPC-2581, and how to motivate more members of the supply chain to accelerate adoption. We also covered how IPC-2581 can be used to facilitate the documentation process, along with conducting upfront design validation before sign-off to manufacturing using simulation and analysis tools. With the new enhancements coming from the latest revision, along with new inputs, we are proving that IPC-2581 is a viable option to drive the manufacturing process. 

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IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

BANNOCKBURN, Ill., USA, April 5, 2016 — The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

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IPC-2581 B1 is in official review process

The IPC-2581 Revision B was passed in fall of 2014. During the adoption of revision B, members identified a few areas that needed additional clarification to avoid multiple iterations of the same element(s). The IPC-2581 consortium’s technical team identified the areas that can potentially be mis-interpreted and came up with an update to revision B and is being called revision B1.

The IPC-2581 rev B1 has just entered its second official review phase following the IPC standards revision policies. Providing there are no major issues found, the next step is to approve the 2581 B1 version by official ballot.

Revision B1 updates include.

  • More material description types used in the creation of printed wiring boards
  • More robust function table, where specific data is targeted to different processes
  • Clarification of schema details were also introduced to better describe data sets and reduce interpretation differences 
  • The function table was also overhauled to improve data requirements for specific steps in the fabrication process that will in turn reduce data clutter and protect company intellectual property.

Research is under way to expand 2581 to include external references, processes for augmentation of data provided by fabrication, assembly, test, and field support. Validation tools are also a general focus to ensure tool providers are following proper protocol which will fall into a certification process. Support for various design technologies such as Rigid-Flex, packaging, and 3D descriptions are also on the table for inclusion into the next revision of IPC-2581.





IPC-2581 Consortium at PCB West 2015

As we have previously stated in our “PCB West 2015” article, the IPC-2581 Consortium will be attending PCB West 2015! Visit us at Booth 610 to speak with a representative of the IPC-2581 Consortium, where we will demonstrate the input and export of IPC-2581 from different tools. The IPC-2581 Consortium will also be hosting a Free Design Session, “An Update on Design Data Transfer Using IPC-2581.” Hemant Shah of Cadence Design Systems on behalf of the Consortium will be presenting on Wednesday, September 16th, from 10:00 AM to 11:00 AM.

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