IPC Awarded Consortium Members for Their Contributions towards IPC-2581 Standard

At IPC Apex Expo 2014, IPC awarded 11 consortium members for their exceptional contributions towards the IPC-2581 standard. These awards recognize their efforts to get the standard updated in a record time - IPC-2581 RevB was proposed, updated and approved in 12 months!

Read more about IPC-2581 Consortium at IPC Apex Expo



Panel Discussion: File Transfer Formats

I-Connect007 hosted a round table panel discussion recently about merits of various PCB design file transfer formats,  Hemant Shah from Cadence Design Systems (representin IPC-2581 Consortium), Karel Taveriner from Ucamco (talking about Gerber) and David Wiens from Mentor Graphics (talking about ODB++) joined the discussion. Panel discussion was moderated by Ben Jordan from Altium. Gerber, ODB++ and IPC-2581, they all have their strengths, so which one should you choose?

 Click here to view the video of this panel discussion  


Visit IPC-2581 Consortium booth at IPC APEX EXPO 2014

IPC APEX EXPO 2014, Las Vegas, NV

 Exhibition: March 25 – 27

Look for IPC-2581 Consortium booth #2430 at IPC APEX EXPO 2014, to see the IPC-2581 adoption progress made since the APEX show last year. The IPC-2581 data will be output from Cadence and Zuken’s PCB Design tools, and then consumed by tools from ADIVA, Downstream Technologies, WISE Software for DFM checking, viewing and documentation. 

Click here to view the floor plan



 IPC-2581 RevB is released!

After 12 months of development and validation, the IPC-2581 RevB was announced and published by IPC recently.  "I've never seen an IPC  standard move that fast," said Gary Carter, Senior Manager of CAD  Engineering at Fujitsu Network Communications, "It's a great example of  what can be accomplished when people from the industry align on and work towards a common goal!"

Significant features in the IPC-2581 RevB include the following:

  • Ability to define "build intent" through stack ordering, material types, technology attributes, and stackup composites
  • Expanded bill of materials (BOM) section to include stackup
  • Geometry object fill types, line types, user-defined primitives
  • Back drilling support
  • Pin one, origin/orientation standard criteria, and pick-up point for packages
  • Pad stack reference definitions
  • Z-axis definition, V-groove cavity/slot report
  • Ability to add more notes on design intent

The PDF version of the standard is free to download now on the IPC website.

Download now